B3DVM-6000x 3D profiler with 6000x magnification and 100nm measurement resolution

3D profiler with Long working distance and very price depth measurement
Advanced software for roughness, height depth and flatness measurement
Up to 6000x magnification, 1 to 70mm sample height/thickness measurement, with 100nm / 0.1um measurement resolution
Incident LED illumination, with brightfield and darkfield imaging
Excellent extended depth of focus/field
auto readout of so many measurements such as contour difference
excellent choice for semi-condocture industry, copper foil, wafer step, arc height, battery, SMT fields

Introduction of B3DVM-6000x 3D profiler with 6000x magnification and 100nm measurement resolution

Features

3D profiler with extended working distance and exceptional depth measurement capabilities
Sophisticated software enabling precise measurements of roughness, height depth, and flatness
Magnification capabilities of up to 6000x, accommodating sample height/thickness measurements ranging from 1mm to 70mm, with a remarkable measurement resolution of 100nm / 0.1μm
Equipped with incident LED illumination, providing both brightfield and darkfield imaging
Remarkable extended depth of field, ensuring excellent imaging quality
Automated readout of numerous measurements, including contour differences
An outstanding choice for applications in the semiconductor industry, covering areas such as copper foil, wafer steps, arc height, batteries, and SMT fields

B3DVM-6000x 3D profiler with 6000x magnification and 100nm measurement resolution

1. 3D Profiler with ultra-depth precision measuring instrument The system allows great measurement of roughness, height, depth and flatness. It has up to 6000x magnification, can do 3D modelling and measure the height at 100nm resolution.
2. 3D Imaging RGB point cloud image Top and bottom view observation with low and high zoom construct 3D graphics, drag and adjust any position at 720′ generate a sectional view superimpose color information on the image use color distinction to bump details
3. Measurement Tools with 3D profiler High precision real time measurement Using 3D modelling, ultra depth of field image synthesis is suitable for depth measurement of products with stepped surfaces, blind holes, grooves and irregular shapes
4. Image Capture Function Real-time high quality images positioning, focusing, magnification conversion and other functions can be performed all through the user friendly software by simply placing a sample on the stage.
5. 100nm resolution in Z depth / focus ultra depth of field synthesis, fine full frame. after ultra depth of field (DOF) synthesis function is applied to a high magnification observation, the depth of field of different planes are superimposed to get a stereoscopic 3D observation of image. The z-axis is driven by a high-precise electromotor, which can measure up to 100nm / 0.1um distance between the positions.
Mixed of brightfield and darkfield illumination