0.33MP & 1.3MP SWIR Machine Vision Camera

$USD 19,950.00

  • SWIR machine vision camera
  • 0.33MP and 1.3MP monochrome camera
  • 400nm -1700nm spectral range
  • Sony Exmor back-illuminated CMOS sensor
  • 2-Step noise reduction technology
  • Ultra-high sensitivity and low-noise
  • External triggering, digital I/O and free-running modes
  • USB 3.0 data transmission interface, compatible with USB2.0 protocol
  • Advanced video and image processing application software BioView,
    • Supports ROI, flip, bit-depth switching and other features;
    • Compatible with Windows/Linux/OSX
    • multi-platform SDK,
    • support native C/C++, C#/VB.Net, DirectShow, Twain API

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It is an excellent choice for any of the following fields:

  • Printed circuit board (PCB) or electronic board inspection
  • Solar cell inspection
  • Semiconductor quality control
  • Transmission observation
  • Optics production inspection
  • Identifying and sorting purpose
  • Water visualization
  • Transparent liquid or plastic imaging
  • Temperature control
  • Surveillance
  • Anti-counterfeiting

BioCam SWIR Cameras

BioCam SWIR camera series is a TE-Cooling USB3.0 InGaAs for short-wavelength infrared (SWIR) imaging application. This SWIR camera is uitable to capture images in both visible and infrared wavelengths, at a wide range of 400nm to 1700nm. It is an excellent choice for high precise and quantitative researches. The camera has a smaller pixel size of 5μm.

The BIC-SWIR-1.3 series SWIR cameras can be used in NIR-II (1000~1700nm)  in vivo microscopic imaging, hyperspectral imaging, laser spot observation, machine vision and general infrared detection, near-infrared spot detection, spot shooting and analysis, near-infrared target recognition, fluorescence imaging, fluorescent material imaging, Image contrast enhancement, night vision imaging, flame monitoring, material defect inspection, chip inspection, solar cell inspection, pharmaceutical and cosmetic inspection, food, fruit and vegetable defect inspection, grain sorting, plastic sorting, perspective inspection.

Detailed Specifications

Parameter Specification
Sensor model Sony IMX 990-AABA-C
Sensor  Type InGaAs
Spectral  Range 400 – 1700nm
Pixel Size 5.0 mm´ 5.0 mm
Sensor Size 1/2″
Frame  Rate & Resolution 1 2 bits 8bit
70fps @ 1280 *1024

135fps @640* 512

13 2 fps@1280*1024

253fps @ 640 *512

DDR3  Memory 512MB (4Gb)
Conversion Gain 4 4.3e/ADU
Dynamic  Range 58.7dB
Readout Noise 211e-
Full  Well 181.6ke-
SNRmax 52.6dB
Sensitivity 121mV
Dark  Current 383e – /s(0 °C ) 510e – /s(10 °C ) 638e – /s(20 °C )
Exposure Time 50us – 60s
Gain Range 1x – 15x
Shutter Global shutter
Binning Software 2×2 , 3×3, 4×4
Data  interface USB3.0
Digital  I/O One optical-coupling isolated input, one optical-coupling isolated output, tow non-isolated input and output
Data Format Mono8 / Mono12
Cooling  Performance -30 °C below ambient temperature
General  Parameters
Power  Supply by USB3.0 interface

12V power adapter

Power  Consumption < 2.1 W ( uncooled )

<25 W ( cooled )

Temperature Working temperature -2 0 ~ 60 ℃ ,

storage temperature – 40 ~ 85 ℃

Humidity 20%-80% , no condensation
Filter 400-1800nm (standard);

1030-1800nm (optional)

Camera Size 80*80*45.5mm
Camera Weight 380g
Lens  Mount C-mount
Software Complete SDK (software development kit)


Operating  System Win32 / WinRT / Linux / Mac OS/Android
Certification CE, FCC


Order Code Sensor & Size(mm) Pixel


G Sensitivity
Dark Signal
FPS/Resolution Binning Exposure
BIC-SWIR-1.3A 1.3M/IMX990(M)
Buit-in TEC
5 x5 121mV with 1/30s
1.0mV with 1/30s
BIC-SWIR-1.3B 1.3M/IMX990(M)
External TEC
5×5 121mV with 1/30s
1.0mV with 1/30s
1×1 1×1 50us~60s
BIC-SWIR-0.33A 0.33M/IMX991(M)
Buit-in TEC
5 x5 121mV with 1/30s
1.0mV with 1/30s
BIC-SWIR-0.33B 0.33M/IMX991(M)
External TEC
5 x5 121mV with 1/30s
1.0mV with 1/30s

M: Monochrome sensor


Spectral response curve

The sensitivity of BIC-SWIR-1.3 series camera with Sony IMX 990-AABA-C  sensor is 121mV. Spectral response curve of the sensor and the quantum efficiency are shown below.




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